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Reconditioned 305mm / sec MPM Printer Machine Edison Stencil Printer Machine

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Reconditioned 305mm / sec MPM Printer Machine Edison Stencil Printer Machine

Reconditioned 305mm / sec MPM Printer Machine Edison Stencil Printer Machine
Reconditioned 305mm / sec MPM Printer Machine Edison Stencil Printer Machine Reconditioned 305mm / sec MPM Printer Machine Edison Stencil Printer Machine

Large Image :  Reconditioned 305mm / sec MPM Printer Machine Edison Stencil Printer Machine

Product Details:
Place of Origin: China
Brand Name: MPM
Model Number: Edison Stencil Printer
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD
Packaging Details: Wooden Box
Delivery Time: 7 to 10 working days
Supply Ability: 1 unit

Reconditioned 305mm / sec MPM Printer Machine Edison Stencil Printer Machine

Description
Features: Faster Throughput For A Better Process Payment Terms: 20% Deposit - 80% Before Delivery
Application: Solder Paste Printer Model: Edison Stencil Printer
Brand: MPM Condition: Original, Pre-owned And Reconditioned
Functionality: For Industrial Use Packaging: Wooden Box
Lead Time: 7-10 Days Payment: L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal
High Light:

305mm / Sec MPM Printer Machine

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Edison Stencil Printer Machine

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Reconditioned MPM Printer Machine

Infinite Automation Co., Ltd. is a trusted name in supplying the best reconditioned second-hand SMT machines and factory automation solution products. Our company is focusing on the supply of pre-owned Solder Paste Printers, SMT Chip Mounters, Automatic Optical Inspection, and other PCB assembly line solution products. Among our offered pre-owned and reconditioned Solder Paste Printing Machine is the MPM Edison Stencil Printer. The MPM Edison™ stencil printer is ideally suited for the growing Automotive and Smart Device manufacturing markets. The Edison printer is the industries’ most accurate printer with +/- 15μ @ 6σ wet print repeatability. Total throughput is lightning fast due in part to the highly efficient, parallel processing of the stencil shuttle system, stencil wiping, paste dispensing, and vision alignment system.

 

MPM EDISON STENCIL PRINTER

 

FEATURES:

  • Advanced Print Head
  • Board Staging
  • EdgeLoc Board Clamping System
  • High Speed Vision Alignment with Ultra-slim Camera
  • Intueri and Industry 4.0 Integration
  • Paste Height Monitor
  • Printpack
  • SPI Print Optimizer
  • Unparalleled Throughput and Speed
  • Unprecedented Access and Back to Back (BTB) Configurable
  • Ultra-fast, High-Efficiency Wiping System

 

Substrate processing:
Maximum substrate size (XxY): 450mmx350mm (17.72"x13.78")
For boards larger than 14", special fixtures are required
Minimum substrate size (XxY): 50mm x 50mm (1.97" x 1.97")
Substrate thickness dimensions: FoilClamps: 0.2mm to 6.0mm (0.007" to 0.236")
EdgeLoc (edge ??clamping system): 0.8mm to 6.0mm (0.031" to 0.236")
Maximum substrate weight: 4.5kg (10lbs)
Substrate edge gap: 3.0mm (0.118")
Bottom clearance: 12.7mm (0.5") standard. Configurable 25.4mm (1.0")
Substrate clamping: fixed top clamping, table vacuum option: EdgeLoc edge clamping system
Substrate support method: magnetic thimble and support block

 

 

Printing parameters:
Maximum printing area (XxY): 450mmx350mm (17.71"x13.78")
Snap-off: 0mm to 6.35mm (0" to 0.25")
Printing speed: 305mm / sec (12.0" / sec)
Printing pressure: 0 to 20kg (0lb to 44lbs)
Template frame size: 737mmx737mm (29"x29") smaller size template optional
Image field of view (FOV): 9.0mm x 6.0mm (0.354" x 0.236")
Reference point type: standard shape reference point (see SMEMA standard), pad/opening
Camera System: Single Digital Camera - Patented Separated Optical Vision
Alignment accuracy and repeatability of the entire system: ±8 μm (±0.0003”)@6σ, Cpk≥2.0*
Technical indicators are represented by process changes in the production environment. This performance data includes printing speed, table rise, and camera movement.
Actual solder paste placement accuracy and repeatability: ±15 μm (±0.0006”)@6σ, Cpk≥2.0*
Actual solder paste print position repeatability based on third-party test system verification
Cycle time: 30015 seconds including printing and wiping, and 20020 seconds including printing and wiping
Power requirements: 200 to 240VAC (±10%) single-phase @50/60Hz, 15A
Compressed air requirements: 100psi@4cfm (standard operating mode) to 18cfm (vacuum wipe) (6.89bar@1.9L/s to 8.5L/s), 12.7mm (0.5") diameter tube
Machine height: (removing the lighthouse) 1580mm (62.2") at 940mm (37.0") transport height
Machine depth: 1442mm (56.77")
Machine width: 1282mm (50.47")
Minimum gap in front: 508mm (20.0")
Minimum clearance behind 508mm (20.0")
The higher the Cpk value, the lower the variability of the process specification limits. In a qualified 6 sigma process (ie, allowing 6 standard deviations to be added or subtracted within the specification limits), Cpk ≥ 2.0. Speedline reserves the right to make changes to the technical specifications without prior notice. Please consult the factory for specific specifications.

 

IMAGES:

 

 

MPM EDISON STENCIL PRINTER image 2

MPM EDISON STENCIL PRINTER image 3

 

 

 

Contact Details
INFINITE AUTOMATION CO ., LIMITED

Contact Person: amor

Tel: 13823274872

Fax: 86-755-23115005

Send your inquiry directly to us (0 / 3000)