220V 50/60Hz 3D Solder Paste Inspector Table Top 3D SPI Measurement System SPI 7500

Experience absolute 3D measurement results using the INFINITE™ SPI 7500 3D Solder Paste Inspector Machine distributed only by Infinite Automation Co., Ltd. INFINITE™ SPI 7500 3D Solder Paste Inspection Machine is a stand-alone True 3D measurement system of laser scan type which is able to measure and analyze. INFINITE™ SPI 7500 3D SPI Table Top is a stand-alone 3D measurement system of laser scan type which is able to measure and analyze the small-sized object image and the print image of Solder Paste as well. In particular, it is an onboard type one suitable for controlling the screen print process optimally by measuring and analyzing the solder cream coated after screenprint in 3D and is also optimal of the off-line type tool to be able to control the screen print process with low investment effectively. With the 3D laser sensor manufactured delicately and 3D image expression having reality, it can analyze the thickness and volume accurately within the error scope of 1-2um. With the color camera, it can discriminate the coated solders from the PCB pattern or solder pad. It is possible to measure 2D (2D auxiliary measurement) such as length, angle, and diameter as well as height and volume of 3D. It is possible to measure the overall PCB area of ​​the size of 300x300mm with the one-touch method. With the adoption of high rigidity scan mechanism, it represents the regular measurement results without the effect of surrounding vibration.it can discriminate the coated solders from the PCB pattern or solder pad. It is possible to measure 2D (2D auxiliary measurement) such as length, angle, and diameter as well as height and volume of 3D. It is possible to measure the overall PCB area of ​​the size of 300x300mm with the one-touch method. With the adoption of high rigidity scan mechanism, it represents the regular measurement results without the effect of surrounding vibration.it can discriminate the coated solders from the PCB pattern or solder pad. It is possible to measure 2D (2D auxiliary measurement) such as length, angle, and diameter as well as height and volume of 3D. It is possible to measure the overall PCB area of ​​the size of 300x300mm with the one-touch method. With the adoption of high rigidity scan mechanism, it represents the regular measurement results without the effect of surrounding vibration.

INFINITE™ SPI 7500 3D Solder Paste Inspector

The Importance of True 3D Solder measurement

The key factors of solder paste quality are its height, volume, and shape.

2D images provide only color, brightness, and area information but not key factors. 3D measurement must be required to get information related to height, volume, and shape. At least 50% of defects of the SMT manufacturing process occur only during printing. The worse the quality of solder paste is, the more placement defects occur. The reliability of electronic products directly links to the solder joint quality and the quality of solder joint is affected by solder pastes height, volume, and shape. Without 3D solder measurement, there is no way to check the exact quality of printing. The earlier defects are found, the less repair cost is required.

• Quick programming, friendly programming interface
• Multiple measurement methods
• True one-button measurement
• Eight-way motion button, one-click focus
• Adjustable scanning pitch
• Solder paste 3D simulation function
• Powerful SPC function
• MARK deviation automatically corrected
• One-click back to the center of the screen
• Automatic Recognition Target This fully automatic 3D solder paste thickness tester can obtain 3D data of each point through the automatic XY stage moving/Z-axis image autofocus and laser scanning solder paste. It can also be used to measure the entire pad solder paste. The average thickness allows the solder paste printing process to be well controlled.

Product Features

• Programmable measurement of several areas, automatic focusing at different test points, overcoming the error caused by plate deformation
• Automatically find the inspection position and correct the offset through the PCB MARK;
• Measurement method: fully automatic, automatic movement manual measurement, manual movement manual measurement
• Solder paste 3D simulation map, reproduce the true appearance of solder paste;
• Using 3-axis automatic movement, focusing, automatic compensation to correct the warpage deformation of the substrate, to obtain accurate solder paste height;
• High-speed high-resolution camera, high precision, powerful SPC data statistical analysis;
• SIGMA automatic judgment function, so that your operators have the ability to determine the quality of the solder paste printing process in real-time;
• Automatically generate CP, CPK, X-BAR, R-CHART, SIGMA column chart, trend chart, control chart, etc.;
• 2D auxiliary measurement, the distance between two points, area size, etc.;
• The measurement result data list is automatically saved, generate an SPC report

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