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ENIG Surface Finish FR-4 Epoxy Fiberglass Carrier Board Designed for Wave Soldering Unloader

ENIG Surface Finish FR-4 Epoxy Fiberglass Carrier Board Designed for Wave Soldering Unloader

Epoxy Fiberglass Carrier Board

Wave Soldering Unloader Carrier Board

Place of Origin:

China

Brand Name:

other

Model Number:

PC BOARD FOR WAVE SOLDERING UNLOADER

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Product Details
Product Name:
Wave Soldering Unloader PC Board
Product Type:
FR-4 Epoxy Fiberglass Carrier Board
Base Material:
High-Temp FR-4 Fiberglass (Tg≥170℃)
Surface Finish:
ENIG (Electroless Nickel Immersion Gold)
Temperature Resistance:
Continuous 260℃/Peak 300℃
Opening Design:
Standard Fixture Locating Holes (±0.1mm)
Highlight:

Epoxy Fiberglass Carrier Board

,

Wave Soldering Unloader Carrier Board

Payment & Shipping Terms
Minimum Order Quantity
1
Price
N/A
Packaging Details
Carton box
Delivery Time
3-5 working days
Payment Terms
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Product Description

High-Performance PC Board for Wave Soldering Unloader - Premium FR-4 Fiberglass Carrier Plate

Product Description:

Our Wave Soldering Unloader PC Board is engineered for precision and durability in demanding SMT assembly environments. Manufactured from industrial-grade FR-4 fiberglass material with high Tg≥170℃, this carrier board maintains exceptional dimensional stability even under continuous exposure to 260℃ lead-free soldering temperatures (peak 300℃).

Key Features & Specifications:

  1. Premium Material Construction

  • High-temperature FR-4 epoxy fiberglass substrate

  • Electroless Nickel Immersion Gold (ENIG) surface finish

  • UL94 V-0 flame retardant certified

  1. Precision Engineering

  • Standard size: 250×150×1.6mm (custom sizes available)

  • ±0.1mm high-precision locating holes

  • Optimized thermal expansion characteristics

  1. Superior Performance

  • Withstands 50,000+ insertion cycles

  • Continuous operation at 260℃ (300℃ peak)

  • Excellent chemical resistance to flux and cleaning agents

  1. Application-Specific Design

  • Compatible with all major wave soldering unloader systems

  • Ideal for lead-free soldering processes

  • Reduces PCB warpage during thermal cycling

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