Features: Pre/Post Inspection Capable
Application: Die Bonder Machine
Features: Voltage: 200 VAC 1 Phase 2 Wires + GND 50/60 Hz Power: 1500 W
Application: Wire Bonder Machine
Features: High Speed Bonding - 9 Wires Per Second
Application: Wire Bonding Machine
Features: Modular Machine Concept For All Micro Assembly Applications
Application: Die Bonder And Flip Chip Bonder
Features: New Generation SD8312 Sets New Industry Record For 12” Soft Solder Die Bonding Process
Application: Soft Solder Die Bonding Machine
Features: Fine Pitch Capability For Advanced Packages
Application: Wire Bonder Machine
Features: Accuracy ± 3 µm @ 3s
Application: Automatic High Precision Die Attach System
Features: High Placement Accuracy
Application: Die Bonder And Flip Chip Bonder
Features: Supports All Die Attach And Flip Chip Applications
Application: Die Bonder And Flip Chip Bonder
Features: World's Most Advanced 3D AOI System
Application: Automatic PCB Inspection In SMT Production Line
Features: Duel-track Equipment
Application: Automatic Solder Paste Inspection In SMT Production Line
Features: High-Speed 100% 3D Solder Paste Inspection
Application: Automatic Solder Paste Inspection In SMT Production Line
Features: Unique 3D-Solder Joint Inspection (3D-SJI) Technology For Best Inspection Capabilities
Application: Automatic PCB Inspection In SMT Production Line
Features: FOV: 10μ: 40×30mm
Application: Automatic PCB Inspection In SMT Production Line
Features: Mounting Speed - 30,000 CPH
Application: SMD Pick And Place Machine
Features: Mounting Speed - 80,000 CPH
Application: Modular Pick And Place Machine
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