PCB SMT Machine

Features: Supports All Die Attach And Flip Chip Applications

Application: Die Bonder And Flip Chip Bonder

Features: New Generation SD8312 Sets New Industry Record For 12” Soft Solder Die Bonding Process

Application: Soft Solder Die Bonding Machine

Features: High Placement Accuracy

Application: Die Bonder And Flip Chip Bonder

Features: Modular Machine Concept For All Micro Assembly Applications

Application: Die Bonder And Flip Chip Bonder

Features: Accuracy ± 3 µm @ 3s

Application: Automatic High Precision Die Attach System

Features: High Speed Bonding - 9 Wires Per Second

Application: Wire Bonding Machine

Features: Fine Pitch Capability For Advanced Packages

Application: Wire Bonder Machine

Features: Voltage: 200 VAC 1 Phase 2 Wires + GND 50/60 Hz Power: 1500 W

Application: Wire Bonder Machine

Features: High Performance Wire Bonder

Application: Wire Bonder Machine

Features: Pre/Post Inspection Capable

Application: Die Bonder Machine

Features: Mounting Speed - 24,000 CPH

Application: Compact Modular SMT Placement Machine

Features: World’s Fastest Mounting Speed In Its Class

Application: SMD Pick And Place Machine

Features: ASM SIPLACE TX Chip Shooter Is A Faster, Smaller, And More Advanced Making This Machine The New High-end Placement Solution

Application: SMD Pick And Place Machine

Features: 67,750 CPH Speed

Application: SMD Pick And Place Machine

Features: Production For Large Panels Or Simultaneous Production Of Two Models

Application: Flexible Placement Platforms

Features: Mounting Speed - 80,000 CPH

Application: Medium-sized Multi-Function Placement Machine