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Omron Automatic 3D AOI Inspection Machine Original and Used VT S730

Features: FOV 30.00×30.72mm

Application: PCB Inspection In SMT Production Line

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Sinic Tek 3D In Line Automatic SPI Machine In SMT Original And Used

Features: Support Windows 7 Professional (64 Bit)

Application: Automatic Solder Paste Inspection In SMT Production Line

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75000CPH Optimum Speed Panasonic NPM-W2S SMT Pick Place Machine

Application: SMT Pick And Place Machine

Brand: Panasonic

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Hanwha SM482 PLUS SMT Mounter For 0603 Microchips To 22mm IC Components

Application: SMT Pick And Place Machine

Brand: Hanwa

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Original And Used Samsung CP45FV SMT Pick And Place Machine

Application: SMT Pick And Place Machine

Brand: Samsung

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ASM AD830 Die Bonder Machine Original And Used Automatic Wire Bonder

Features: Pre/Post Inspection Capable

Application: Die Bonder Machine

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ASM IHAWK XTREME Automatic Wire Bonding Machine Original And Used

Features: Voltage: 200 VAC 1 Phase 2 Wires + GND 50/60 Hz Power: 1500 W

Application: Wire Bonder Machine

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ASM AB550 Automatic Wire Bonder Original and Used Wire Bond Machine

Features: High Speed Bonding - 9 Wires Per Second

Application: Wire Bonding Machine

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ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

Features: Modular Machine Concept For All Micro Assembly Applications

Application: Die Bonder And Flip Chip Bonder

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ASM SD8312 Automatic Soft Solder Die Bonder Machine Original and Used

Features: New Generation SD8312 Sets New Industry Record For 12” Soft Solder Die Bonding Process

Application: Soft Solder Die Bonding Machine

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ASM AB589 Series PCB SMT Machine Rotary Head Wire Bond Machine

Features: Fine Pitch Capability For Advanced Packages

Application: Wire Bonder Machine

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ASM Photon PCB SMT Machine High Precision Die Attach Machine

Features: Accuracy ± 3 µm @ 3s

Application: Automatic High Precision Die Attach System

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ASM AD210 Plus PCB SMT Machine Automatic Die Bonding Machine

Features: High Placement Accuracy

Application: Die Bonder And Flip Chip Bonder

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ASM NANO PCB SMT Machine Die Bonder And Flip Chip Bonder Machine

Features: Supports All Die Attach And Flip Chip Applications

Application: Die Bonder And Flip Chip Bonder

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VT S1080 Automatic Optical Inspection Machine Original and Used

Features: World's Most Advanced 3D AOI System

Application: Automatic PCB Inspection In SMT Production Line

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Sinic Tek 3D SMT SPI Machine S450 Solder Paste Inspection Equipment

Features: Duel-track Equipment

Application: Automatic Solder Paste Inspection In SMT Production Line

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