Place of Origin:
China
Brand Name:
INFINITE™
Model Number:
SPI 6500
Avail of Infinite Automation's perfect solution to your Solder Paste Thickness testing. Here we are introducing our high accuracy Solder Paste Thickness Testing Machine, the INFINITE™ 3D SPI 6500 Solder Paste Thickness Tester. This Solder Paste Thickness Testing Equipment is easy to use. INFINITE™ 3D SPI 6500 Solder Paste Thickness Tester is designed with a user-friendly programming interface. This SPI equipment has multiple measurement methods, adjustable scanning distance, 3D image simulation function, independent 3D dynamic observer, and a powerful SPC function.
INFINITE™ 3D SPI 6500 Solder Paste Thickness Tester
Product Function:
Product Features:
Technical Parameters:
PARAMETERS |
1. Product model: SPI-6500 |
2. Application range: solder paste. Red glue. BGA. FPC. CSP |
3. Measurement items: thickness. Area, volume, 3D shape, plane distance |
4. Measurement principle: laser 3-angle function method measurement automatically calculates and displays the PCB deformation or tilt angle |
5. Software language: Chinese/English |
6. Lighting source: white high-brightness LED |
7. Measuring light source: Red laser module Y-axis movement range: 50 mm |
8. Measurement method: automatic full-screen measurement. Frame selection automatic measurement. Frame selection manual measurement |
9. Field of view: 12mm*15mm |
10. Camera pixels: 3 million/field of view |
12. The highest resolution: 0.1um |
13. Scanning distance: 5 um /10 um /15 um /20 um |
14. Repeated measurement accuracy: height is less than plus or minus 1um, area <1%, volume <1% magnification: 50X |
15. Maximum measurable height: 5 mm |
16. The highest measurement speed: 250Profiles/s |
17. 3D mode: 3 different 3D simulation images of surface, line, and point, which can be zoomed and rotated |
Images:
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