Product Details:
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Features: | Modular Machine Concept For All Micro Assembly Applications | Application: | Die Bonder And Flip Chip Bonder |
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Model: | NOVA Plus | Brand: | ASM |
Condition: | Original And Pre-owned | Functionality: | For Industrial Use |
Packaging: | Wooden Crate | Lead Time: | 15 Working Days |
Payment Terms: | 20% Deposit - 80% Before Delivery | Price: | Negotiable |
High Light: | ASM Flip Chip Die Bonder,NOVA Plus Flip Chip Die Bonder,ASM Die Bonder Machine |
ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used
ASM NOVA Plus Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder
ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more. The Nova Plus Die Bonder / Flip Chip Bonder has a wide range of features.
Infinite Automation has a big quantity of stock for Semiconductor related equipment. Among our featured machines are original and used ASM NOVA Plus Die Bonder and Flip Chip Bonder. Infinite Automation has more than 200 hundred units of Die Bonding and Die Attach, and Wire Bonding machines available. Infinite Automation is a trusted China supplier of best-conditioned pre-owned factory automation machines and production line equipment. Contact our Sales and Customer Support Team for inquiries.
ASM NOVA Plus Die Bonder and Flip Chip Bonder
Dimensions
W x D x H
1240 x 2140 x 1980 mm
Features:
Autoloading for up to:
Optional:
... and more!
The Nova Plus Die Bonder / Flip Chip Bonder is designed for the following markets:
Contact Person: amor
Tel: 13823274872
Fax: 86-755-23115005