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ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

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ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used
ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

Large Image :  ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

Product Details:
Place of Origin: China
Brand Name: ASM
Model Number: NOVA Plus
Payment & Shipping Terms:
Minimum Order Quantity: 1 unit
Packaging Details: Wooden Box

ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

Description
Features: Modular Machine Concept For All Micro Assembly Applications Price: Negotiable
Payment Terms: 20% Deposit - 80% Before Delivery Application: Die Bonder And Flip Chip Bonder
Model: NOVA Plus Brand: ASM
Condition: Original And Pre-owned Functionality: For Industrial Use
Packaging: Wooden Crate Lead Time: 15 Working Days
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ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

 

ASM NOVA Plus Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder

 

ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more. The Nova Plus Die Bonder / Flip Chip Bonder has a wide range of features.

 

Infinite Automation has a big quantity of stock for Semiconductor related equipment. Among our featured machines are original and used ASM NOVA Plus Die Bonder and Flip Chip Bonder. Infinite Automation has more than 200 hundred units of Die Bonding and Die Attach, and Wire Bonding machines available. Infinite Automation is a trusted China supplier of best-conditioned pre-owned factory automation machines and production line equipment. Contact our Sales and Customer Support Team for inquiries.

 

ASM NOVA Plus Die Bonder and Flip Chip Bonder

 

Dimensions

W x D x H

1240 x 2140 x 1980 mm

 

Features:

  • high precision die bonder / flip chip bonder
  • accuracy +/- 2.5 µm @ 3s
  • a cycle- time of < 3 sec*
  • modular machine concept for all micro-assembly applications
  • eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing
  • multi flip-chip bonding
  • wafer mapping
  • post bond inspection/ measurement
  • substrate working area of 550 x 600 mm
  • active bond-force-control

 

Autoloading for up to:

  • 12" wafers
  • 300 mm wafers
  • 450 mm substrate wafers

 

Optional:

  • UV- Curing
  • Dispensing

... and more!

 

The Nova Plus Die Bonder / Flip Chip Bonder is designed for the following markets:

  • Semiconductor advanced packaging- (TSV, eWLB, Fan-Out, WLP, 3D, Stack Die)
  • MEMS
  • Automotive Sensors
  • RFID
  • LED
  • Optoelectronic

ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used 0

 

 

Contact Details
INFINITE AUTOMATION CO ., LIMITED

Contact Person: amor

Tel: 13823274872

Fax: 86-755-23115005

Send your inquiry directly to us (0 / 3000)