ASM NANO PCB SMT Machine Die Bonder And Flip Chip Bonder Machine

ASM NANO PCB SMT Machine Die Bonder And Flip Chip Bonder Machine

ASM NANO Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder Machine

Infinite Automation is the best choice if you are looking for dependable Factory Automation Machines and Production Equipment. Among Our offered machines are original and pre-owned Die Bonding and Die Attach, Wire Bonding, Die Bonder and Flip Chip Bonder Machines. Infinite Automation has a big quantity of stock for Semiconductor related equipment. Among our featured machines are original and used ASM NANO Die Bonder and Flip Chip Bonder.

Infinite Automation has more than 200 hundred units of Die Bonding and Die Attach, and Wire Bonding machines available. Infinite Automation is a trusted China supplier of best-conditioned pre-owned factory automation machines and production line equipment. Contact our Sales and Customer Support Team for inquiries.

ASM NANO Die Bonder and Flip Chip Bonder

Dimensions

W x D x H

1690 x 1430 x 2040 mm

The NANO Die Bonder / Flip Chip Bonder has a wide range of features including the following:

• Supports ± 0.3µm @ 3s placement accuracy
• Supports all Die Attach and Flip Chip applications
• High precision alignment optics
• Vibration Damping System
• Automatic Placement Offset Tuning System
• High resolution 300mm Bonding Station
• Dynamic Alignment System
• Quantitative Parallelism Calibration
• In-situ Eutectic Bonding Capability
• 3x Different Heated Options incl. Laser Soldering System
• Epoxy Stamping and Dispensing capability
• UV Curing capability at the Bond Station
• Post-bond Inspection and Wafer Mapping Software
• Clean Room Inside with HEPA Filter and Ionizer
• Modular Machine Concept

The NANO Die Bonder / Flip Chip Bonder is designed for the following markets:

• Silicon Photonics
• Optical Device Packaging
• WLP
• Direct Bond Interconnect

NANO is an ultra-precision die and flip-chip bonder for highly demanding assembly tasks billed as the highest-precision placement system in its class. Aiming at today’s, and future placement demands, NANO enables the reliable handling of ultra-small and very thin die.
 

ASM AMICRA‘s die bonding technology was specifically designed to serve the photonic assembly market by providing the ultimate placement accuracy while supporting a high-speed AuSn eutectic bonding process. ASM AMICRA has been perfecting this technology for almost 20 years, developing high-resolution imaging systems to support the dynamic alignment system, implementing a fiber laser to be used as the primary heat source for AuSn eutectic bonding, high-resolution motion control systems mounted on a granite structure with a special vibration damping system. The principle design of this vision-driven die bonder is to mount all 4x imaging systems in fixed positions, mounted to granite, while all other motion control systems move around the vision cameras. This fundamental design concept produces the highest precision placement accuracy die bonder in the industry today.