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MH550 3D AOI AI-Powered Solder Component Inspection for Industrial SMT Lines – Affordable Machine

MH550 3D AOI AI-Powered Solder Component Inspection for Industrial SMT Lines – Affordable Machine

Industrial SMT Lines AOI

3D AOI AI-Powered

Solder Component Inspection AOI

Place of Origin:

China

Brand Name:

Minghao

Model Number:

MH550/MH550DH/MH550DL

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Request A Quote
Product Details
Machine Description:
3D AOI
Model:
MH550/MH550DH/MH550DL
Condition:
Original And New
Functionality:
Industrial Use (SMT)
Packaging:
Wooden Box
Lead Time:
30 To 40 Working Days
Payment:
TT, PAYPAL, L/C, D/A, D/P, Western Union, MoneyGram
Highlight:

Industrial SMT Lines AOI

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3D AOI AI-Powered

,

Solder Component Inspection AOI

Payment & Shipping Terms
Minimum Order Quantity
1 unit
Price
USD
Packaging Details
Wooden Box
Delivery Time
30 to 40 working days
Payment Terms
L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal
Supply Ability
10 units
Product Description

Product Description: MH550/MH550DH/MH550DL In-line PCBA 3D Optical Inspection Equipment

Manufacturer: Shenzhen Minghao Vision Technology Co., LTD

Overview

The MH550 series is an advanced 3D optical inspection system designed for high-precision detection of solder defects and component anomalies in PCBA (Printed Circuit Board Assembly) production lines. Leveraging structured light imaging and deep learning algorithms, it delivers sub-micron measurement accuracy (≤1µm repeatability) for superior defect identification with minimal false alarms.


Key Features

Category Description
Technology 3D structured light imaging + deep neural networks (DNN) for intelligent defect classification.
Detection Scope Components: Missing, misaligned, flipped, skewed, damaged. Solder: Insufficient/excessive solder, bridging, voids, cold joints, tin beads (≥120µm).
Speed & Efficiency 0.55 sec/FOV; supports mixed-board production with automatic program switching.
Imaging Resolution 10µm/15µm (FOV: 40×30mm/60×45mm); RGB+W light source + 4-direction structured light.
Data & Connectivity Barcode/QR code recognition, SPC analytics, MES integration, and remote monitoring.
Hardware 12MP high-speed camera, servo-driven gear mechanism, NVIDIA GPU acceleration.
Customization Configurable for PCB sizes: 50×50mm to 1200×460mm; thickness: 0.5–6mm.

Technical Specifications

Model MH550 MH550DH MH550DL
PCB Size 50×50mm – 510×460mm 50×50mm – 510×600mm 50×50mm – 1200×460mm
Component Height Top/Bottom: 40mm Top/Bottom: 40mm Top/Bottom: 40mm
Resolution 10µm @ 40×30mm FOV 15µm @ 60×45mm FOV 10µm/15µm configurable
Power 2KVA (AC220V) 2.5KVA (AC220V) 2.5KVA (AC220V)
Weight ~880kg ~1100kg ~1100kg

Core Advantages

Ultra-High Precision

1µm repeatability with dynamic adaptive calibration.Multi-angle projection (4/8-direction) eliminates shadows and distortions.

AI-Driven Efficiency

One-click programming: Auto-detection of trained components/solder joints.SPC alarms and real-time data export for traceability.

Robust Hardware

High-rigidity structure reduces vibration during high-speed operation.GPU-accelerated algorithms (CUDA, OpenMP) for rapid 3reconstruction.

Versatile Applications

Compatible with pre-/post-reflow inspection in SMT lines.                                                                                                                                  Supports bare boards and assembled devices.

MH550 3D AOI AI-Powered Solder Component Inspection for Industrial SMT Lines – Affordable Machine 0

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