Product Details:
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Features: | 5.5 μm Resolution For Ultra-High Precision Metrology-grade Inspection | Application: | AOI - Automatic Optical Inspection |
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Machine Description: | 3D PCB Automated Inspection Machine | Brand: | TRI |
Model: | TR7700QM SII | Condition: | Original And Used |
Functionality: | Industrial Use | Packaging: | Wooden Box |
Lead Time: | 1 To 5 Working Days | Payment: | L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal |
High Light: | TR7700QM SII SMT AOI Machine,TR7700QM SII,TR7700QM SII PCB AOI Machine |
TR7700QM SII Smart 3D SMT AOI Machine PCB Automated Inspection Machine
Pre-owned TR7700QM SII Smart 3D AOI Machine, 3D PCB Automated Inspection Machine
The TR7700QM SII is built on a high accuracy platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with metrology capabilities and flexible inspection algorithms.
Features:
• Semiconductor and Packaging technology Inspection.
• 5.5 μm Resolution for Ultra-High Precision Metrology-grade Inspection
• Ready to Inspect in Minutes with TRI's Smart Programming
• Multiple 3D Technologies for Full coverage Inspection
Specifications:
Imaging Method | Stop-and-Go |
Top Camera | 12 MP High Speed Camera |
Angle Camera | N/A |
Imaging Resolution | 5.5 μm |
Lighting | Multi-phase True Color LED |
3D Technology | Quad Digital Fringe Projectors |
Max. 3D Range | 20 mm |
Imaging Speed | Up to 7.7 cm²/sec |
X-Axis Control | Ballscrew + AC Servo with Motion Controller |
Y-Axis Control | Ballscrew + AC Servo with Motion Controller |
Z-Axis Control | Ballscrew + AC Servo with Motion Controller |
X-Y Axis Resolution | 1 μm with Optional Linear Encoder |
Max PCB Size | 400 x 330 mm |
PCB Thickness | 0.6 - 5mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm. Optional: 5 mm |
Conveyor | 880 - 920 mm |
Component | Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component |
Solder | Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/ Contamination |
WxDxH | 1000 x 1460 x 1650 mm Note: not including signal tower, signal tower height 515 mm |
Weight | 785 kg |
Contact Person: amor
Tel: 13823274872
Fax: 86-755-23115005