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MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings

MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings

Industrial SMT SPI Machine

3D SPI Machine

Accurate Solder Paste Inspection SPI Machine

Place of Origin:

China

Brand Name:

Minghao

Model Number:

MH310/MH310DH/310DL

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Request A Quote
Product Details
Machine Description:
3D SPI
Model:
MH310/MH310DH/310DL
Condition:
Original And New
Functionality:
Industrial Use (SMT)
Packaging:
Wooden Box
Lead Time:
30 To 40 Working Days
Payment:
TT, PAYPAL, L/C, D/A, D/P, Western Union, MoneyGram
Highlight:

Industrial SMT SPI Machine

,

3D SPI Machine

,

Accurate Solder Paste Inspection SPI Machine

Payment & Shipping Terms
Minimum Order Quantity
1 unit
Price
USD
Packaging Details
Wooden Box
Delivery Time
1 to 5 working days
Payment Terms
L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal
Supply Ability
10 units
Product Description

Product Description: MH310 Series 3D Solder Paste Inspection (SPI) Machine

Manufacturer: Shenzhen Minghao Vision Technology Co., Ltd.

The MH310 Series is a high-precision, 3D optical inspection system designed for real-time detection of solder paste defects in SMT (Surface Mount Technology) production lines. Utilizing phase modulation contour measurement (PMP) technology, it ensures micron-level accuracy (0.37µm resolution) while maintaining high-speed performance. The system supports closed-loop feedback with printers, SPC data analysis, and multi-machine interoperability for Industry 4.0 smart manufacturing.

Key Features & Advantages

Feature Benefit
Phase Modulation Contour (PMP) Technology Achieves 3D measurement with 0.37µm resolution, detecting defects like insufficient/excessive solder, misalignment, and bridging.
Multi-Head Imaging Simultaneous multi-angle inspection improves speed vs. traditional single-head SPI.
Far-Center Lens Static Compensation Eliminates errors caused by FPC (flexible PCB) warping without Z-axis adjustment.
Printer Closed-Loop Control Automatically sends stencil cleaning/alignment commands to printers to improve yield.
SPC & MES Integration Real-time statistical process control (SPC) and compatibility with factory MES systems.
BadMark Sharing Skips defective boards in mounters, boosting efficiency.

Technical Specifications (MH310/MH310DH/MH310DL Models)

Parameter MH310 MH310DH MH310DL
Inspection Area 50×50mm to 510×460mm 50×50mm to 510×600mm 50×50mm to 1200×460mm
Thickness Range 0.5mm–6mm 0.5mm–6mm 0.5mm–6mm
Component Height Top/Bottom: ±10mm Top: +10mm, Bottom: +40mm Top: +40mm, Bottom: +40mm
Light Source RGB-W 4-color integral light Customizable multi-directional lighting High-speed industrial camera
Detection Speed Up to 900Kx (customizable) Optimized for dual-head configurations Large-area scanning

Applications

Post-Printing Inspection: Installed after solder paste printers in SMT lines.

Defect Types: Measures volume, height, misalignment, bridging, and solder splatter.

Industry 4.0: Supports data traceability, multi-machine control (1 operator:4 machines), and AI-driven analytics.

Certifications & Compliance

Patents for PMP technology, software copyrights, and ISO quality management certifications.

Target Industries: PCB assembly, automotive electronics, consumer electronics, and medical device manufacturing.

MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings 0

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