Place of Origin:
China
Brand Name:
TRI
Model Number:
TR7700 SIII DT
TR7700 SIII DT Desktop SMT AO Solution For Pre Post Reflow Inspection
TR7700 SIII DT High precision desktop AOI solution for pre/post-reflow inspection
TR7700 SIII DT is a high-performance desktop AOI solution designed for maximum precision and ease of use. Using TRI's exclusive multi-phase lighting and next-generation inspection software, TR7700 SIII DT delivers excellent defect detection with quick & easy programming ideal for frequently changing productions.
Features
Specifications
| Imaging Method | Dynamic Imaging |
| Top Camera | 4 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 10 µm, 15 µm (factory setting) |
| Lighting | Multi-phase RGB+W LED |
| 3D Technology | N/A |
| Max. 3D Range | N/A |
| Imaging Speed | 4 Mpix@ 10 µm: 60 cm²/sec 4 Mpix@ 12.5 µm: 120 cm²/sec |
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1 µm |
| Max PCB Size | TR7700 SIII DT: 330 x 250 mm TR7700L SIII DT: 510 x 460 mm |
| PCB Thickness | 3 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm [48 mm optional] |
| Bottom Clearance | TR7700 SIII DT: 100 mm TR7700L SIII DT: 50 mm |
| Edge Clearance | 3 mm |
| Conveyor | Manual |
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material |
| Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
| WxDxH | TR7700 SIII DT: 860 x 1100 x 1350 mm TR7700L SIII DT: 980 x 1345 x 1490 mm |
| Weight | TR7700 SIII DT: 340 kg TR7700L SIII DT: 385 kg |
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