asm wire bonder machine (9) Online Manufacturer
Features: Voltage: 200 VAC 1 Phase 2 Wires + GND 50/60 Hz Power: 1500 W
Application: Wire Bonder Machine
Features: Fine Pitch Capability For Advanced Packages
Application: Wire Bonder Machine
Features: Modular Machine Concept For All Micro Assembly Applications
Application: Die Bonder And Flip Chip Bonder
Features: New Generation SD8312 Sets New Industry Record For 12” Soft Solder Die Bonding Process
Application: Soft Solder Die Bonding Machine
Features: Pre/Post Inspection Capable
Application: Die Bonder Machine
Features: High Speed Bonding - 9 Wires Per Second
Application: Wire Bonding Machine
Features: Supports All Die Attach And Flip Chip Applications
Application: Die Bonder And Flip Chip Bonder
Features: Accuracy ± 10 µm @ 3s
Application: Wire Bonder Machine
Features: High Placement Accuracy
Application: Die Bonder And Flip Chip Bonder
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